Thermo-Mechanical Simulation of Die-Level Packaged 3-axis MEMS Gyroscope Performance
March 30, 2018A Sub-1 Hz Resonance Frequency Resonator Enabled by Multi-Step Tuning for Micro-Seismometer
January 8, 2022You must have an account on our Customer Portal to access this content. If you already have an account, please log in using the form below or to the right. If you do not have an account, we invite you to request an account.
Whitepaper: New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow
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This paper presents the benefits of using statistical models during MEMS design, through the virtual reproduction of a test structure for measuring a beam’s pull-in voltage. This electrical measurement is used as a functional indicator of the process quality for manufactured wafers. Statistical variations of process parameters (material properties, silicon thickness, sidewall angle and edge shift due to etching tolerances) are included in our study using a MEMS Process Design Kit. This statistical data is used during Monte Carlo simulation, to evaluate the influence of expected manufacturing variability on the performance of our test structure.
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