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A Study of the Impact of Line Edge Roughness on Metal Line Resistance using Virtual Fabrication
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- A Study of the Impact of Line Edge Roughness on Metal Line Resistance using Virtual Fabrication
A Study of the Impact of Line Edge Roughness on Metal Line Resistance using Virtual Fabrication
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A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
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- A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
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Backside Power Delivery as a Scaling Knob for Future Systems
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- Backside Power Delivery as a Scaling Knob for Future Systems
Backside Power Delivery as a Scaling Knob for Future Systems
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Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
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- Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
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CMOS Area Scaling and the Need for High Aspect Ratio Vias
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- CMOS Area Scaling and the Need for High Aspect Ratio Vias
CMOS Area Scaling and the Need for High Aspect Ratio Vias
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Self-Aligned Block and Fully Self-Aligned Via for iN5 Metal 2 Self-Aligned Quadruple Patterning
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- Self-Aligned Block and Fully Self-Aligned Via for iN5 Metal 2 Self-Aligned Quadruple Patterning
Self-Aligned Block and Fully Self-Aligned Via for iN5 Metal 2 Self-Aligned Quadruple Patterning
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Modeling of Tone Inversion Process Flow for N5 Interconnect to Characterize Block Tip to Tip
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- Modeling of Tone Inversion Process Flow for N5 Interconnect to Characterize Block Tip to Tip
Modeling of Tone Inversion Process Flow for N5 Interconnect to Characterize Block Tip to Tip
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Understanding how small variations in photoresist shape significantly impact multi-patterning yield
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- Understanding how small variations in photoresist shape significantly impact multi-patterning yield
Understanding how small variations in photoresist shape significantly impact multi-patterning yield
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A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard N5 BEOL two-level metal flow
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- A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard N5 BEOL two-level metal flow
A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard N5 BEOL two-level metal flow
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