Lithography and Patterning Archives - Coventor

Pathfinding by process window modeling: Advanced DRAM capacitor patterning process window evaluation using virtual fabrication
Read more - Pathfinding by process window modeling: Advanced DRAM capacitor patterning process window evaluation using virtual fabrication
Pathfinding by process window modeling: Advanced DRAM capacitor patterning process window evaluation using virtual fabrication
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A Study of the Impact of Line Edge Roughness on Metal Line Resistance using Virtual Fabrication
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A Study of the Impact of Line Edge Roughness on Metal Line Resistance using Virtual Fabrication
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A Triple-Deck CFET Structure with an Integrated SRAM Cell for the 2nm Technology Node and Beyond
Read more - A Triple-Deck CFET Structure with an Integrated SRAM Cell for the 2nm Technology Node and Beyond
A Triple-Deck CFET Structure with an Integrated SRAM Cell for the 2nm Technology Node and Beyond
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A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM
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A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM
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Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
Read more - Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
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Backside Power Delivery as a Scaling Knob for Future Systems
Read more - Backside Power Delivery as a Scaling Knob for Future Systems
Backside Power Delivery as a Scaling Knob for Future Systems
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Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
Read more - Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
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Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
Read more - Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
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CMOS Area Scaling and the Need for High Aspect Ratio Vias
Read more - CMOS Area Scaling and the Need for High Aspect Ratio Vias
CMOS Area Scaling and the Need for High Aspect Ratio Vias
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